Tea break from Thump’s vote recalculation, let’s make a little talk on multi-wire sawing technology

 

From Nov. 26, Donald Trump are facing the crisis of recalculate his vote score. If you are just drifting from the hot ‘ Thump - Hillary - three swing states’ thing, and would like different atmosphere, we can learn together about the multi-wire sawing technology, a new popular skill in machinery industry.
 
      Let’s take the semiconductor material and the silicon wafer for the example to make a little introduction of the multi-wire saw.
 

 
      Silicon wafer is the main material in semiconductor and photovoltaic production, but how to produce the silicon wafers? Generally there are a few different ways. Talking form long time ago, there were the old traditional ways like metal blade sawing and the wheel grinding, until so far another two advanced ways like laser cutting and inner slicing which are still popular in the market. Different from all them, mult-wire sawing is to run forth and back a group of metal wires on the silicon bar in the grinding fluid where there are plenty of free grinding particles. The wires are running over in so high speed that it moves plenty of grinding particles rubbing the silicon material, then the grinding particles finish the sawing job.
 
      In the whole processing, the wires, under the guidance of 10+ guide rollers, will construct a wire net , square and flat, between the main rollers. And the workbench will move a trip up or down to make sure the wires run into the silicon workpiece to cut them or get out when the cutting is over. Due to the all wires working together, they are accomplishing a mass production in sheets, which means tens output one-off at a time or even hundreds or up to thousand output as long as you ask for a tiny thin sheet. The machine can produce different thickness by changing the main rollers with different groove distance. In all, multi-wire sawing is a new and most popular machinery processing technology to cut the hard & brittle materials into hundreds of thin sheets one-off at a time by moving plenty of grinding particles along with the multi-wire on the surface of the workpiece materials.
 
      The CNC multi-wire saw, base on the core R&D, accomplishes the requirements in high precision high speed and low cost from all-around in cutting hard & brittle materials, and fulfills the industrial blank in market. This technology obtains many proprietary intellectual property rights, and reaches up to the advanced level internationally, furthermore, the wire tension control skill, and the synchronous skill between the wire withdrawing & releasing motors and the main motor, have been in leading level internationally.
 

      The multi-wire sawing technology and the multi-wire saw machine are invented & designed particularly for cutting the hard & brittle materials, or other wear-resisting materials, with the features as below:

1.   extremely economical: hundreds of sheets one-off at a time.
2.   nearly no damage to the workpiece.
3.   nearly no detect in geometry cutting (TTV, bow)
4.   applicable to cut the hard & brittle materials, and any other wear-resisting materials.
5.   Low loss, low wastage, low deviation.