Technique features
This cutting machine is effective cutting equipment, which have high accuracy and good features, and can cut piezo quartz, semiconductor monocrystalline that used in the semiconductor and micro-electronics profession and chilling plate, ceramic plate.
The working theory is to bring the grounding materials to the waiting for cutting area and ground, the innovative technique that can be cutting the parts into dozens of bars can effectively reduce the scrap rate, improve the cutting speed.
The controlling theory is to control the whole driving of the cutting process by using the sports controller, and can finish it accurately by easily input the human-machine screen.
Meanwhile it uses the double side row line control system, improve the stability of the whole machine system, fault rate of the broking line will be reduced.
Technique data
