Diamond Multiwire Saw, the best tool to bulk produce the wafers from sapphires, silcons and the simi
Multiwire Saw, different from the single wire saw which can proceed only one kerf line and divide the materials into two parts only, can move a set of wires towards to the same direction and effect lots of parallel kerfs to separate the materials into lots of flat segment products in the same shapes and same thickness.
Commonly, these products would be wafers, windows or substrates made of the sapphires, silicons, advanced ceramics, optical glass, magnets, rare metal alloys. All the materials are valuable and hard and brittle. For example to produce the the smart phone screen, the watch mirror, the solar silicon wafer.
The Multiwire Saw are typed for different applications Squaring and Wafering. The Squaring Multiwire Saw is designed to cut the original raw materials into big sizes like 30mm or 60mm etc. For example to cut the rectangular blocks 400x400x300mm into 160pcs of small rectangular blocks 100x50x60mm, or to cut the long cylindrical bar Φ50x400mm into 4pcs of short bars Φ50x100mm. The finished sizes is relatively bigger than the wafers.
Squaring, sometimes, is preparing step for the next wafering job we are going to talk about below. The Wafering Multiwire Saw is designed to produce the the thickness in ≥ 0.1mm, for example the solar silicon wafers or watch windows. The cutting difficulty will be changed due to the asked segment sizes and the thicknesses. The bigger the segment contour (LxW or diameter) and the thinner the thickness, the more difficult in cutting. The cutting wires will be displayed more dense than the squaring machine, to come out the bulk wafering effect. Always, these kind of material cutting jobs ask for high level cutting precision and the flatness precision. In order to realize the ‘bulk’ producing consequence, the separated material blocks could be glued together and then to be put into the machine to be sliced by the multiwires, and then separate the wafers alone. Multiwire cutting can effect the bulk production, and the Glued-Then-Cut can boost the productive capacity for several times. In order to meet the different cutting requirements for different materials, there are two different cutting technology: the Diamond Multiwire Saw and the Slurry Cutting Multiwire Saw. Diamond type costs higher but environment-friendly and save more materials. Slurry type costs lower but the user has to handle the slurry waste.
Since it is a really high-demanding job to make such a thin thickness, the machine performance must be ensured and so we do.
In the industrial application, there are some other cutting tools to be used still to cut the hard and brittle materials, like the inside diameter slicers, the wire electrical discharge machining, and the single wire saw. But all them are far behind from our Multiwire Saw machines in the bulk productive capacity, as well as in the cutting precision and the flatness, even in the raw material saving. (Diamond) Multiwire Saw is the best tool for the hard material cutting industry with the globally most advanced technology. SINOPOLY is the reputable manufacturer of the diamond multiwire saw machines and the slurry cutting multiwire saw machines. Welcome to contact us for more information. Thank you.
Product inquiry: lyn@sinopolytech.com
