Multi wire saw is using diamond wire cutting materials, which with the advantages of high cutting effiency, high cutting precision, and perfect cutting result. Comparing with inner diameter saws (ID Saws) and Wire Cut Electro Discharge Machining (WEDM), wire saws have unique preponderance, and almost equal to 70 sets ID Saws and over 100 sets WEDM, the wire cutting speed is about 1200m/min and 1500m/min.
Wire saws improved and advanced a lot and also make up the disadvantages of these two kinds of cutting machine. Using Inner diameter saws and Wire Cut Electro Discharge Machining cutting materials, there is usually appeared rough surface and too marks, for the product that customer required with high precision, it needs grinding to get the better polished. Also, their cutting speed is low, ID Saws can cut little several pieces, but wire saws can cut hundreds of wafers.
Beijing Sinopoly Multi Wire saws take up the leading position, comparing to the industry leaders of multi wire saws, such as Meyer Burger Switzerland and Takatori Japan.
The diamond wire cutting machine can cut many kinds of advanced materials, mainly hard and brittle materials. Not only can cut Sapphire products, but also Crystal, Optical glass, Lens, Special Ceramics, Ceramic-glass, Magnetic materials, NdFeB (neodymium iron boron) Fliament, Solar electric, Ferrite, Alloys, precious Metel, Semiconductor, Silicon ect.
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